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Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package

  • Published:2020 Issue: Volume:8 Page:143494-143501
  • ISSN:2169-3536
  • Container-title:IEEE Access
  • language:
  • Short-container-title:IEEE Access

Author:

Yuan Cadmus C. A.ORCID,Lee Chang-Chi

Funder

Developing Smart Automation Mechatronics System and Internet of Things for Shoe Manufacturing Project of Feng Chia University

Ministry of Science and Technology

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering,General Materials Science,General Computer Science

Cited by 22 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design and Evaluation of Packaging Art Based on Sentimental Value Calculation and Clustering;International Journal of Information Technologies and Systems Approach;2024-07-17

2. AI-assisted Design for Reliability: Review and Perspectives;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

3. Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network;Journal of Electronic Packaging;2024-02-07

4. Physics-Informed Machine Learning for Solder Design and Reliability Prediction for Electronics;2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific);2024-01-29

5. Large-Scale $$\mathscr {H}_2$$ Optimization for Thermo-Mechanical Reliability of Electronics;Mathematics in Industry;2024
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