In-Plane and Out-Of-Plane Analyses of Encapsulated Mems Device by IR Laser Vibrometry-Reference-Cited by-同舟云学术

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In-Plane and Out-Of-Plane Analyses of Encapsulated Mems Device by IR Laser Vibrometry

Published:2022-01-09 Issue: Volume: Page:
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Container-title:2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)
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Author:

Ennen Malte,Lherbette Michael L.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9698823/9699435/09699714.pdf?arnumber=9699714

Reference5 articles.

1. In-plane optical measurement of vibrations of MEMS: gradient methods using interferometry and image processing

2. Digital double pulse-TV-holography

3. On the relative motion of the Earth and the luminiferous ether

4. In-plane vibration measurement of microdevices by the knife-edge technique in reflection mode

5. Concept and proof for an all-silicon MEMS microspeaker utilizing air chambers;kaiser;Microsyst Nanoeng,2019

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Acoustic Transmission Measurements for Extracting the Mechanical Properties of Complex 3D MEMS Transducers;Micromachines;2024-08-24

2. Characterization of the dynamics of encapsulated silicon MEMS devices using low-coherence heterodyne LDV technology;Micro and Nano Engineering;2023-06

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