On-Chip Integration of Orthogonal Subsystems Enabled by Broadband Twist at 220–325 GHz
Author:
Affiliation:
1. Division of Micro and Nanosystems, KTH Royal Institute of Technology, Stockholm, Sweden
Funder
Swedish Research Council (VR) from the European Union’s Horizon 2020 Research and Innovation Program
Marie Skłodowska-Curie
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Link
http://xplorestaging.ieee.org/ielx7/22/10241248/10073582.pdf?arnumber=10073582
Reference35 articles.
1. A $Ka$ -Band $E$ -Plane Waveguide Magic-T With Coplanar Arms
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4. 500–600 GHz submillimeter-wave 3.3 bit RF MEMS phase shifter integrated in micromachined waveguide
5. Monolithic Wafer-Level Rectangular Waveguide and Its Transition to Coplanar Waveguide Line Using a Simplified 3-D Fabrication Process
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