Integrating InP MMICs and Silicon Micromachined Waveguides for Sub-THz Systems-Reference-Cited by-同舟云学术

Integrating InP MMICs and Silicon Micromachined Waveguides for Sub-THz Systems

Published:2023-10 Issue:10 Volume:44 Page:1800-1803
ISSN:0741-3106
Container-title:IEEE Electron Device Letters
language:
Short-container-title:IEEE Electron Device Lett.

Author:

Beuerle Bernhard¹^ORCID,Svedin Jan²,Malmqvist Robert²,Vassilev Vessen³^ORCID,Shah Umer⁴^ORCID,Zirath Herbert³^ORCID,Oberhammer Joachim⁴^ORCID

Affiliation:

1. TeraSi AB, 139 33 Stockholm, Sweden

2. Department of Radar Systems, Swedish Defense Research Agency, 583 30 Linköping, Sweden

3. Department of Microtechnology and Nanoscience, Chalmers University of Technology, 412 58 Gothenburg, Sweden

4. Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, 100 44 Stockholm, Sweden

Funder

Stiftelsen f?r?Strategisk Forskning

European Research Council

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/55/10265125/10225624.pdf?arnumber=10225624

Reference21 articles.

1. A 340–380 GHz Integrated CB-CPW-to-Waveguide Transition for Sub Millimeter-Wave MMIC Packaging

2. Full band waveguide-to-microstrip probe transitions;leong;IEEE MTT-S Int Microw Symp Dig,1999

3. WR1.5 Silicon Micromachined Waveguide Components and Active Circuit Integration Methodology

4. THz Monolithic Integrated Circuits Using InP High Electron Mobility Transistors

5. A Silicon-Micromachined Waveguide Platform With Axial Ports for Integrated Sub-THz Filters

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A CPW Probe to Rectangular Waveguide Transition for On-Wafer Micromachined Waveguide Characterization;IEEE Transactions on Terahertz Science and Technology;2024-01

2. Wafer Level Integration of Sub-THz and THz Systems;IEEE Microwave and Wireless Technology Letters;2023