Quantitative Defect Size Evaluation in Fluid-Carrying Nonmetallic Pipes
Author:
Affiliation:
1. Department of Electrical and Computer Engineering, New York Institute of Technology, New York, NY, USA
Funder
U.S. National Science Foundation
New York Institute of Technology’s Institutional Support for Research and Creativity (ISRC) Grants
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Link
https://ieeexplore.ieee.org/ielam/22/9851481/9826526-aam.pdf
Reference38 articles.
1. A Low-Cost and Compact Three-Dimensional Microwave Holographic Imaging System
2. Three-Dimensional Holographic Imaging Using Single Frequency Microwave Data
3. Thickness profile estimation of fluid-carrying non-metallic pipes;shah;Proc IEEE Int Microw Symp (IMS),2022
4. Microwave Holographic Imaging of Nonmetallic Concentric Pipes
5. Real‐Time Three‐Dimensional Imaging of Dielectric Bodies Using Microwave/Millimeter‐Wave Holography
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