Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects-Reference-Cited by-同舟云学术

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Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects

Published:2014-11 Issue:6 Volume:13 Page:1118-1126
ISSN:1536-125X
Container-title:IEEE Transactions on Nanotechnology
language:
Short-container-title:IEEE Trans. Nanotechnology

Author:

Xu Pingye,Tong Fei,Davis Virginia A.,Park Minseo,Hamilton Michael C.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Science Applications

Link

http://xplorestaging.ieee.org/ielx7/7729/6949178/06858086.pdf?arnumber=6858086

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrical Modeling and Performance Analysis of Cu and CNT Based TSV-Bump-RDL;IEEE Transactions on Nanotechnology;2024

2. Performance Analysis of Bump in Tapered TSV: Impact on Crosstalk and Power Loss;IEEE Open Journal of Nanotechnology;2022

3. Signal Integrity and Power Loss Analysis for Different Bump Structures in Cylindrical TSV;Communications in Computer and Information Science;2022

4. Research progress of electrical properties based on carbon nanotubes; interconnection;Ferroelectrics;2020-08-17

5. Solution-Deposited Carbon Nanotube Flip Chip Interconnect for High-Frequency Applications;IEEE Microwave and Wireless Components Letters;2015-04

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