Accelerating FinFET MOL Process Development Using Design for Inspection Methodology
Author:
Affiliation:
1. Shanghai Huali Integrated Circuit Corporation,Shanghai,China 201314
2. PDF Solutions, Inc.,Santa Clara,CA 95050,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9792471/9792473/09792513.pdf?arnumber=9792513
Reference8 articles.
1. Novel E-beam Techniques for Inspection and Monitoring;strojwas;2022 EDTM,0
2. Advanced high throughput e-beam inspection with DirectScan;strojwas;2021 NANOTS,0
3. New Method for BEOL Overlay and Process Margin Characterization;yang;2022 EDTM,0
4. Efficient metrology for edge placement error (EPE) characterization using design for inspection methodology
5. Middle of Line: Challenges and Their Resolution for FinFET Technology
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1. Application of e-Beam Voltage Contrast Technique for Overlay Improvement and Process Window Control in Multi-Patterning Interconnect Scheme;IEEE Journal of the Electron Devices Society;2022
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