Integration benefits and challenges on Fan-Out to enable system in package for IoT/Wearable Devices

Author:

Tang Humi,Lu Max,Tsai Jensen,Jiang Jase,Cheng Honda,Lu Terrence,Wang Yu-Po

Publisher

IEEE

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Large-Scale Cu Interconnection of Organic Substrate Materials Through Electroless Plating Technology;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

2. Studies and Application of A Novel Failure Localization Method for 3D Stacked IC Chips;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

3. Experimental Study of Transient Dose Rate Effect on System-in-Package SZ0501;IEEE Transactions on Nuclear Science;2022-08

4. Advanced Fanout Packaging Technology for Hybrid Substrate Integration;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

5. Quantum AI and IoT Cognitive Disease Data Security to Evade Quantum Computing Attacks;Bio-Inspired Algorithms and Devices for Treatment of Cognitive Diseases Using Future Technologies;2022-02-11

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