Author:
Chen Eason,Lan Albert,You Jack,Liao Mark
Cited by
3 articles.
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2. Molded Interconnect Substrate (MIS) Technology for Semiconductor Packages;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
3. Analysis and Measurement of Power Integrity and Jitter Impacts on Thin-Core and Coreless Packages;2016 IEEE 66th Electronic Components and Technology Conference (ECTC);2016-05