Novel Concept of an In-situ Test System for the Thermal-Mechanical Fatigue Measurement for Reliability Evaluation of Electronic Solder Joints-Reference-Cited by-同舟云学术

Novel Concept of an In-situ Test System for the Thermal-Mechanical Fatigue Measurement for Reliability Evaluation of Electronic Solder Joints

Published:2018-12 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
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Author:

Metasch Rene¹,Roellig Mike¹,Naumann Uwe²,Wiesenhutter Felix²,Kaufmann R.³

Affiliation:

1. Fraunhofer Institute for Ceramic Technologies and Systems IKTS, Germany

2. Hegewald & Peschke Mess- und Prueftechnik GmbH, Germany

3. Mytron Bio- und Solartechnik GmbH, Germany

Publisher

IEEE

Link

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Finite-Element Modeling of the Visco-Plastic Shear-Dominant Deformation Behavior of a Creep-Resistant Sn-Based Solder Alloy under TMF Testing;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25

2. Optimized TMF Measurement Setup for Reproducible Lifetime Measurements on Solder Joints Under Accelerated Thermal-Mechanical Conditions;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25

3. Deformations in Structures of Electronic Systems under External Impacts;2021 IEEE International Conference on Information and Telecommunication Technologies and Radio Electronics (UkrMiCo);2021-11-29