Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration-Reference-Cited by-同舟云学术

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Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration

Published:2014-12 Issue: Volume: Page:
ISSN:
Container-title:2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)
language:
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Author:

Wojnowski M.¹,Pressel K.²,Beer G.²,Heinig A.³,Dittrich M.³,Wolf J.⁴

Affiliation:

1. Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany

2. Infineon Technologies AG, Wernerwerkstraße 2, 93049 Regensburg, Germany

3. Fraunhofer Institute for Integrated Circuits IIS, Design Automation Division EAS, Zeunerstraße 38, 01069 Dresden, Germany

4. Fraunhofer IZM-ASSID, Ringstraße 12, 01468 Moritzburg, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7005556/7028249/07028413.pdf?arnumber=7028413

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3. Antenna Integration in eWLB Package;Antenna‐in‐Package Technology and Applications;2020-03-06

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