Author:
Che F. X.,Lin Jong-Kai,Au K. Y.,Zhang Xiaowu
Cited by
3 articles.
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1. Flip Chip Process Enablement in IC Memory Stacked Die Package;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Thin Die Flip Chip Process Enablement for Stacked IC Memory Packages;2023 International Conference on Electronics Packaging (ICEP);2023-04-19
3. Warpage Control During Mass Reflow Flip Chip Assembly Using Temporary Adhesive Bonding;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05