Author:
Hsiang-Yao Hsiao,Wee David Ho Soon,Lim Simon Siak Boon,Chong Ser Choong,PS Sharon Lim,Chong Chai Tai
Cited by
8 articles.
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1. The HRDL Interposer Technology Using Metal/Polymer Hybrid Bonding and Its Characteristics;IEEE Transactions on Materials for Electron Devices;2024
2. Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-10
3. FEA simulation and modeling for fan-out package design;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
4. Process Development of Fan-Out with Multi-layer RDL for Chiplets Packaging;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
5. Heterogeneous Integration for Chiplets on FOWLP Development Line;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05