Non-destructive testing of through silicon vias by high-resolution X-ray/CT techniques-Reference-Cited by-同舟云学术

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Non-destructive testing of through silicon vias by high-resolution X-ray/CT techniques

Published:2012-12 Issue: Volume: Page:
ISSN:
Container-title:2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)
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Author:

Xiangmeng Jing ,Daquan Yu ,Lixi Wan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6504698/6507037/06507139.pdf?arnumber=6507139

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Singular Value Decomposition-Based Adaptive Sampling Approximate Message Passing Net for Sparse-View CT Reconstruction;IEEE Photonics Journal;2024-02

3. High-resolution X-ray computed tomography of through silicon vias for RF MEMS integrated passive device applications;Microelectronics Reliability;2015-08

4. Oblique Angle Artifact Reduction Using Wavelet-Based Filtering in Off-Centered Circular Geometry of Cone Beam Computed Tomography;2014 International Symposium on Optomechatronic Technologies;2014-11

5. Void Detection in TSVs With X-Ray Image Multithreshold Segmentation and Artificial Neural Networks;IEEE Transactions on Components, Packaging and Manufacturing Technology;2014-07

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