Laser de-bonding process development of glass substrate for Fan-out wafer level packaging
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7840091/7861428/07861439.pdf?arnumber=7861439
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Process Development of Fan-Out with Multi-layer RDL for Chiplets Packaging;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
2. Laser Lift‐Off Technologies for Ultra‐Thin Emerging Electronics: Mechanisms, Applications, and Progress;Advanced Materials Technologies;2022-11-13
3. Nondestructive Laser Debonding of Designable Responsive and Buffer Layers for Wafer Level Packaging;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
4. Ultra-thin wafer technology and applications: A review;Materials Science in Semiconductor Processing;2020-01
5. Application of Laser Lift-off Technique in Flexible Electronics Manufacturing;Chinese Journal of Lasers;2020
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