Adaptive Hybrid Framework for Multiscale Void Inspection of Chip Resistor Solder Joints-Reference-Cited by-同舟云学术

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Adaptive Hybrid Framework for Multiscale Void Inspection of Chip Resistor Solder Joints

Published:2023 Issue: Volume:72 Page:1-12
ISSN:0018-9456
Container-title:IEEE Transactions on Instrumentation and Measurement
language:
Short-container-title:IEEE Trans. Instrum. Meas.

Author:

Xiao Pan¹^ORCID,Xiao Meng²^ORCID,Cai Nian²^ORCID,Qiu Baojun³^ORCID,Zhou Shuai³^ORCID,Wang Han¹^ORCID

Affiliation:

1. State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou, China

2. School of Information Engineering, Guangdong University of Technology, Guangzhou, China

3. China Electronic Product Reliability and Environment Testing Research Institute, Guangzhou, China

Funder

National Natural Science Foundation of China

Key Laboratory Construction Projects in Guangdong

Research Fund for Colleges and Universities in Huizhou

National Natural Science Foundation of Guangdong Province, China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Instrumentation

Link

http://xplorestaging.ieee.org/ielx7/19/10012124/10012345.pdf?arnumber=10012345

Reference38 articles.

1. Comparing Python and C++ Efficiency Through Sorting

2. Fuzzy region-based active contour driven by global and local fitting energy for image segmentation

3. Active contours driven by region-scalable fitting and optimized Laplacian of Gaussian energy for image segmentation

4. A Level Set Method with Dynamic Prior for Cell Image Segmentation

5. Active contours driven by local image fitting energy

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Segmentation of void defects in X-ray images of chip solder joints based on PCB-DeepLabV3 algorithm;Scientific Reports;2024-05-24

2. X-ray Void Defect Detection in Chip Solder Joints Based on PCB-DeepLabV3 Algorithm;2023-11-09

3. PCBA analysis using X-ray images with processing tools.;2023-11-08

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