Reliability evaluation of sintered silver and Sn-3Ag-0.5Cu solder joints using a thermal cycling test
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Publisher
IEEE
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http://xplorestaging.ieee.org/ielx7/8030508/8046389/08046518.pdf?arnumber=8046518
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Novel Ag-Cu foam sheet with multi-layer composite structure for high performance joining of SiC power chips;Materials Characterization;2024-03
2. Thermal cycling characterization of integrated GaN power module;2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe);2023-09-04
3. Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore;Journal of Materials Research and Technology;2023-07
4. Evaluation of Low-Pressure-Sintered Multi-Layer Substrates for Medium-Voltage SiC Power Modules;2021 IEEE Applied Power Electronics Conference and Exposition (APEC);2021-06-14
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