Dry film photo resists and polymers - the low cost option for standard and 3-D wafer level packaging-Reference-Cited by-同舟云学术

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Dry film photo resists and polymers - the low cost option for standard and 3-D wafer level packaging

Published:2010-08 Issue: Volume: Page:
ISSN:
Container-title:2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
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Author:

Baumgartner Tobias¹,Hauck Karin¹,Topper Michael¹,Manessis Dion¹,Ehrmann Oswin¹,Lang Klaus-Dieter¹,Liebsch Werner²,Ehlin Mats³,Itabashi Toshiaki⁴

Affiliation:

1. Fraunhofer IZM, Gustav-Meyer-Allee 25, 13355 Berlin, Germany

2. DuPont de Nemours s.a.r.l., Rue General Patton, Contern, L-2984 Luxembourg

3. DuPont Electronic Technologies, Research Triangle Park, NC, USA

4. DuPont Kabushiki Kaisha, Sanno Park Tower 11-1, Nagata-cho 2-chome, Chiyoda-ku, Tokyo 100-6111, Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5570125/5582326/05582369.pdf?arnumber=5582369

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. RF-MEMS packaging by using quartz caps and epoxy polymers;Microsystem Technologies;2014-07-12

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