Author:
Giacomozzi Flavio,Mulloni Viviana,Colpo Sabrina,Faes Alessandro,Sordo Guido,Girardi Stefano
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. Baumgartner T, Hauck K, Topper M et al (2010) Dry film photo resists and polymers—the low cost option for standard and 3-D wafer level packaging. In: 11th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Xi’an, China, 16–19 Aug, 2010, pp 50–54
2. Esashi M (2008) Wafer level packaging of MEMS. J Micromech Microeng 18:073001. doi: 10.1088/0960-1317/18/7/073001
3. Giacomozzi F, Mulloni V, Colpo S, Iannacci J, Margesin B, Faes A (2011) A flexible fabrication process for RF-MEMS devices. Romanian J Inf Sci Technol 14(3):259–268
4. Jourdain A, De Moor P, Baert K, DeWolf I, Tilmans HAC (2005) Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-) MEMS devices. J Micromech Microeng 15(2005):S89–S96. doi: 10.1088/0960-1317/15/7/013
5. Kim J, Seok S, Sharma P, Rolland N, Rolland PA (2011) Low loss zero-level packaging for high frequency RF applications by using PerMX dry film photoresist. In: 41st European Microwave Conference, Manchester, 10–13 Oct 2011
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