Author:
Zong Fei,Zhou Naikuo,Niu Jiyong,Sun Zhimei
Cited by
3 articles.
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1. Exploring trade-offs in multi-site wafer testing;2024 IEEE 25th Latin American Test Symposium (LATS);2024-04-09
2. Reliability and Failure of Microelectronic Materials;Reliability of Organic Compounds in Microelectronics and Optoelectronics;2022
3. Structural characterization of semiconductor multi-layer pad;Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science;2021-07-19