Author:
Wei He,Huang Chun-yue,Lu Liang-kun,Wang Jian-pei
Cited by
3 articles.
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1. A fast and simple method to place sub-die under Chip-let architecture based on thermal simulation;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Design and Optimization of Microchannel in a Fan-out Package for Heat Dissipation;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
3. A layout-to-simulation approach for thermal design of IC;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01