Review of board-level solder joint reliability under environmental stress-Reference-Cited by-同舟云学术

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Review of board-level solder joint reliability under environmental stress

Published:2016-10 Issue: Volume: Page:
ISSN:
Container-title:2016 Prognostics and System Health Management Conference (PHM-Chengdu)
language:
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Author:

Fang Lu,Bo Jing,Wei Tang

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7810913/7819727/07819918.pdf?arnumber=7819918

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Health Monitoring Fatigue Properties of Solder Interconnects in LED Drivers;Recent Advances in Microelectronics Reliability;2024

2. Vibration Analysis of an On-Board Charger Assembly for Electrical Mobility;ARAI Journal of Mobility Technology;2023-08-10

3. Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints;IEEE Transactions on Device and Materials Reliability;2022-06

4. Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements;Journal of Electronic Packaging;2019-03-01

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