Vibration Analysis of an On-Board Charger Assembly for Electrical Mobility

Author:

Shantaram Jadhav ,Shantanu Kalurkar ,Srikanth T.S.

Abstract

This article deals with the vibration analysis of an On-Board Charger assembly to check the strength of its components with respect to vibrational load. On-Board Charger (OBC) is a system which is built for electrical vehicles to charge high-voltage battery packs by converting AC power from an external charging source into a DC voltage. The primary role of an onboard charger is to manage the flow of electricity from the grid to the battery. This means that the OBC should fit the necessities of the grid in locations wherever it will be used. Onboard chargers enable plug-in hybrid and battery electric vehicles (BEV) to charge anywhere, not just at designated charging locations, wherever there is AC power. The OBC which is studied in this article is used in three-wheeler vehicles and the weight of this assembly is quite more because of the heat sink and other electronic components; so it is important to check its strength through a vibrational point of view, as induced vibrational load in the vehicle is more while driving the vehicle. Here, the focus will be on all housing and its internal components such as PCB (Printed Circuit Board) and its electrical components. Electrical components connect with PCB with solder joints which provide mechanical and electrical connections between components and PCB. Simulation of an OBC assembly is done by using the ANSYS tool in which modal and harmonic analysis is carried out to check assembly’s strength. The main focus will be on the natural frequencies of the assembly; the aim is to increase the natural frequencies of the assembly above 150 Hz to avoid the resonating condition. The frequency response analysis was done for the range of 50-150 Hz for the acceleration of 15g and stresses and deformation of OBC assembly components are observed after frequency response analysis. Keywords: On-Board Charger; Solder joint; Frequency; Vibration, Harmonic analysis, Electrical Mobility, Materials, NVH, Simulation

Publisher

BSP Books Private Limited

Reference4 articles.

1. Lu Fang, Jing Bo, and Tang Wei, Review of Board-level Solder Joint Reliability under Environmental Stress, 2016, IEEE.

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3. ANSYS Inc, ANSYS Mechanical User's Guide.

4. Mechanical Vibrations Singiresu S. Rao, Pearson Education, Incorporated, 2017.

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