Effect of material and geometry parameters on the thermo-mechanical reliability of flip-chip assemblies
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx4/5657/15158/00689540.pdf?arnumber=689540
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A Parametric Study of Thermal Stress and Analysis of Creep Strain Under Thermal Cyclic Loading in a Hybrid Quad Flat Package;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-03
2. Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design;Journal of Electronic Materials;2016-12-13
3. Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics;Journal of Electronic Packaging;2015-09-01
4. Underfill Filler Settling Effect on the Die Backside Interfacial Stresses of Flip Chip Packages;Journal of Electronic Packaging;2008-07-30
5. Three-dimensional Finite Element Analysis of Thermomechanical Behavior in Flip-chip Packages under Temperature Cycling Conditions;Journal of Reinforced Plastics and Composites;2005-08-16
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