Evolution of Interfacial Properties under Long Term Isothermal Aging of PCB/Potting Compound Interfacial Samples under Pure Mode-I Loading-Reference-Cited by-同舟云学术

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Evolution of Interfacial Properties under Long Term Isothermal Aging of PCB/Potting Compound Interfacial Samples under Pure Mode-I Loading

Published:2022-05-31 Issue: Volume: Page:
ISSN:
Container-title:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Lall Pradeep¹,Pandurangan Aathi Raja Ram¹,Blecker Ken²

Affiliation:

1. Auburn University,NSF-CAVE3, Electronic Research Center,Department of Mechanical Engineering,Auburn,AL,36849

2. US Army CCDC-AC,NJ,07885

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899577.pdf?arnumber=9899577

Reference15 articles.

1. Effect of Shock Angle on Solder-Joint Reliability of Potted Assemblies Under High-G Shock

2. Effect of Drop Angle Variation and Restraint Mechanisms on Surface Mount Electronics Under High G Shock

3. Non-Perpendicular High-G Shock on Potted Fine Pitch Electronics Under Sustained High Temperature Aging

4. Interfacial Fracture Toughness of PCB/Epoxy Interfaces Under Three Point and Four Point Loading with Sustained High Temperature Exposure

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interfacial Reliability and Predictive Models for Potted Board Assemblies in Inclined 25000 g Mechanical Shock;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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