Compact Thermal Modelling of Magnetic Components via Real Coded Genetic Algorithm-Reference-Cited by-同舟云学术

Compact Thermal Modelling of Magnetic Components via Real Coded Genetic Algorithm

Published:2022-05-31 Issue: Volume: Page:
ISSN:
Container-title:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Dey Anshuman¹,Shafiei Navid²,Khandekhar Rahul²,Eberle Wilson¹,Li Ri¹

Affiliation:

1. University of British Columbia,Kelowna,Canada,V1V 1V7

2. Alpha Technologies Ltd,Burnaby,Canada,V5J 5M4

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899579.pdf?arnumber=9899579

Reference16 articles.

1. Novel Approach to the Extraction of Delphi-like Boundary-Condition-Independent Compact Thermal Models of Planar Transformer Devices;bissuel;19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),2018

2. Boundary Condition Independent Thermal Network Modelling of High Frequency Power Transforners;dey;Heat Transfer Eng,0

3. The world of thermal characterization according to DELPHI-Part I: Background to DELPHI

4. Ten Years of Boundary-Condition- Independent Compact Thermal Modeling of Electronic Parts: A Review

5. Fast and Accurate Thermal Modeling of Magnetic Components by FEA-Based Homogenization;jaritz;IEE Trans Power Electron,2020

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1. Low Computational Cost Thermal Modelling of High-Frequency Power Transformers using an Admittance Matrix Apporach;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

2. Compact Thermal Modeling of Magnetic Components Using an Admittance Matrix Approach;Heat Transfer Engineering;2023-01-17