Thermal Management Performance of an Additively Manufactured Jet Impingement Cooler for Power Electronics
Author:
Affiliation:
1. University of Arkansas,Department of Mechanical Engineering,Fayetteville,Arkansas
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899637.pdf?arnumber=9899637
Reference23 articles.
1. Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5D integrated systems
2. Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles
3. Jet Impingement Heat Transfer: Physics, Correlations, and Numerical Modeling
4. Convective Heat Transfer by Impingement of Circular Liquid Jets
5. General Characterization of Jet Impingement Array Heat Sinks With Interspersed Fluid Extraction Ports for Uniform High-Flux Cooling
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Design of a Cylindrical Jet Impingement Cooling System for High-Power Common-Mode Choke in Aerospace Applications;2024 IEEE Applied Power Electronics Conference and Exposition (APEC);2024-02-25
2. Jet Impingement Heat Sinks With Application Toward Power Electronics Cooling: A Review;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-06
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