Integrated Flip-Chip Flex-Circuit Packaging for Power Electronics Applications-Reference-Cited by-同舟云学术

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Integrated Flip-Chip Flex-Circuit Packaging for Power Electronics Applications

Published:2004-03 Issue:2 Volume:19 Page:515-522
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:en
Short-container-title:IEEE Trans. Power Electron.

Author:

Xiao Y.,Shah H.N.,Natarajan R.,Rymaszewski E.J.,Chow T.P.,Gutmann R.J.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/63/28467/01271336.pdf?arnumber=1271336

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Finite Element and Experimental Analysis of Spacer Designs for Reducing the Thermomechanical Stress in Double-Sided Cooling Power Modules;IEEE Journal of Emerging and Selected Topics in Power Electronics;2021-08

3. A Wire Bondless SiC Switching Cell With a Vertically Integrated Gate Driver;IEEE Transactions on Power Electronics;2020-09

4. Efficient layout design automation for multi‐chip SiC modules targeting small footprint and low parasitic;IET Power Electronics;2020-08

5. Optimization of a Cascaded H-Bridge Inverter for Electric Vehicle Applications Including Cost Consideration;Energies;2019-11-08

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