Glass for Encapsulating High-Temperature Power Modules-Reference-Cited by-同舟云学术

Glass for Encapsulating High-Temperature Power Modules

Published:2021-06 Issue:3 Volume:9 Page:3725-3734
ISSN:2168-6777
Container-title:IEEE Journal of Emerging and Selected Topics in Power Electronics
language:
Short-container-title:IEEE J. Emerg. Sel. Topics Power Electron.

Author:

Liu Lanbing^ORCID,Nam David,Guo Ben,Ewanchuk Jeffrey,Burgos Rolando^ORCID,Lu Guo-Quan^ORCID

Funder

Fellowship grant from the Raytheon Technologies Research Center. There is no intellectual property disclosed by Raytheon Technologies Corporation

Raytheon Technologies Corporation is not liable for any mistakes, omissions, etc., as it does not represent Raytheon Technologies Corporation’s work or opinion

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Link

http://xplorestaging.ieee.org/ielx7/6245517/9444897/09121927.pdf?arnumber=9121927

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Tuning the thermal and insulation properties of bismuth borate glass for SiC power electronics packaging;Journal of the American Ceramic Society;2023-12

2. Electrical Properties of Silicone Gel for WBG-Based Power Module Packaging at High Temperatures;IEEE Transactions on Dielectrics and Electrical Insulation;2023-04

3. Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective;Journal of Physics D: Applied Physics;2023-02-16

4. Review of High-Temperature Power Electronics Converters;IEEE Transactions on Power Electronics;2022-12

5. High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-11