Analysis and Design Optimization of Tilted Rounded-Rectangular Pin-Fins Heat Sink for xEV Double-Sided Cooling Power Module-Reference-Cited by-同舟云学术

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Analysis and Design Optimization of Tilted Rounded-Rectangular Pin-Fins Heat Sink for xEV Double-Sided Cooling Power Module

Published:2024-04 Issue:2 Volume:12 Page:1803-1812
ISSN:2168-6777
Container-title:IEEE Journal of Emerging and Selected Topics in Power Electronics
language:
Short-container-title:IEEE J. Emerg. Sel. Topics Power Electron.

Author:

Cho Seongmoo¹,Pyun Sunghyun¹,Yoon Sang Won²^ORCID

Affiliation:

1. Department of Automotive Engineering, Hanyang University, Seoul, South Korea

2. Department of Electrical and Computer Engineering and Inter-university Semiconductor Research Center (ISRC), Seoul National University, Seoul, South Korea

Funder

National Research Foundation of Korea (NRF) through the Korea Government

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/6245517/10490300/10401229.pdf?arnumber=10401229

Reference36 articles.

1. Nickel–Tin Transient Liquid Phase Bonding Toward High-Temperature Operational Power Electronics in Electrified Vehicles

2. Comprehensive Review and State of Development of Double-Sided Cooled Package Technology for Automotive Power Modules

3. Next generation electric drives for HEV/EV propulsion systems: Technology, trends and challenges

4. Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles

5. Characteristics of a SiC MOSFET-based Double Side Cooled High Performance Power Module for Automotive Traction Inverter Applications

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