Investigation of Vehicle-Oriented Double-Sided Cooling Power Module With BGA Technology
Author:
Affiliation:
1. State Key Laboratory of High-Performance Complex Manufacturing and the School of Mechanical and Electrical Engineering, Central South University, Changsha, China
2. Coresing Semiconductor Technology Company, Ltd., Zhuzhou, Hunan, China
Funder
Key Research and Development Program of Hunan Province
National Science Fund for Distinguished Young Scholars of Hunan Province of China
Key Science and Technology Project of Changsha City, China
Project of National Power Semiconductor Manufacturing Innovation Center of Changsha Zhuzhou and Xiangtan Cities, China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Energy Engineering and Power Technology
Link
http://xplorestaging.ieee.org/ielx7/6245517/9908063/09833490.pdf?arnumber=9833490
Reference25 articles.
1. The enhanced reliability of the DBC with integrated internal isolation;inpil;Power Convers Intell Motion (PCIM) Eur Conf,0
2. Reliability Improvement of a Double-Sided IGBT Module by Lowering Stress Gradient Using Molybdenum Buffers
3. Built-in Reliability Design of Highly Integrated Solid-State Power Switches With Metal Bump Interconnects
4. Finite Element and Experimental Analysis of Spacer Designs for Reducing the Thermomechanical Stress in Double-Sided Cooling Power Modules
5. Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module
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