Design of Ultracompact Gate Driver Integrated With Current Sensor and Commutation Path for a 211-kW Three-Level SiC Aircraft Propulsion Inverter
Author:
Affiliation:
1. Department of Electrical and Computer Engineering, Center for Power Electronics Systems (CPES), Virginia Polytechnic Institute and State University, Blacksburg, VA, USA
2. Airbus Group, Toulouse, France
Funder
Airbus, Toulouse, France
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Energy Engineering and Power Technology
Link
http://xplorestaging.ieee.org/ielx7/6245517/10199163/10049466.pdf?arnumber=10049466
Reference36 articles.
1. Design of a 10 kV SiC MOSFET-based high-density, high-efficiency, modular medium-voltage power converter;mocevic;iEnergy,2022
2. A three-level, T-type, power electronics building block using Si-SiC hybrid switch for high-speed drives
3. A Line-Frequency Commutated HV VSC Embedded Modular Multilevel Converter With DC Fault Blocking Capability
4. Busbar Design and Optimization for Voltage Overshoot Mitigation of a Silicon Carbide High-Power Three-Phase T-Type Inverter
5. Investigation, Evaluation, and Optimization of Stray Inductance in Laminated Busbar
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