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Application of Nonlinear Fracture Mechanics Parameter to Predicting Wire-Liftoff Lifetime of Power Module at Elevated Temperatures

  • Published:2019-09 Issue:3 Volume:7 Page:1604-1614
  • ISSN:2168-6777
  • Container-title:IEEE Journal of Emerging and Selected Topics in Power Electronics
  • language:
  • Short-container-title:IEEE J. Emerg. Sel. Topics Power Electron.

Author:

Shishido NobuyukiORCID,Hayama Yutaka,Morooka Wataru,Hagihara Seiya,Miyazaki Noriyuki

Funder

JSPS Grant-in-Aid for Scientific Research

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wirebond State-of-Health Measurements Using Specific, Nondestructive Electrical and Thermal Methods;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-12

2. Application of redefined J-integral range ΔJ for ultra-low cycle fatigue problems with large magnitude of elastic-plastic deformation;Theoretical and Applied Fracture Mechanics;2023-08

3. Review of the Failure Mechanism and Methodologies of IGBT Bonding Wire;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-07

4. Increasing the Reliability of Aluminum Wirebonds by Thermal Treatments: Analysis and Implementation;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-06

5. Creep Effect on the Crack Growth Rate of Wire Bonds in IGBT Power Modules;IEEE Transactions on Power Electronics;2023
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