Mechanical Stress Distribution in Epoxy Encapsulation of 500kV Prefabricated HVDC Cable Joint under Extreme Cold Weather
Author:
Affiliation:
1. Beijing Institute of Smart Energy,Beijing,China,102209
2. State Grid Corporation of China,Beijing,China,100031
3. State Grid Jibei Electric Power Research Institute,Beijing,China,100045
Funder
State Grid Corporation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10177268/10177219/10177363.pdf?arnumber=10177363
Reference17 articles.
1. Curing Kinetics and Dielectric Properties of Anhydride Cured Epoxy Resin With Different Accelerator Contents
2. Surface Charging Affecting Metal Particle Lifting Behaviors Around Epoxy Spacer of HVDC GIL/GIS
3. Interface Damage Driven Electrical Degradation Dynamics of Glass Fiber-Reinforced Epoxy Composites;li;Composite Science and Technology,2023
4. Curing Degree Dependence of Dielectric Properties of Bisphenol-A-Based Epoxy Resin Cured With Methyl Hexahydrophthalic Anhydride
5. Study on Non-Uniformity and Dynamic Fracture Characteristics of GIL Tri-Post Insulators Considering Al2O3 Sedimentation;li;High Voltage early access,0
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