Author:
Cai Yu-Jie,Hsu Yang,Chang Yao-Wen
Cited by
4 articles.
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1. Any-Angle Routing for Redistribution Layers in 2.5D IC Packages;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09
2. Obstacle-Avoiding Multiple Redistribution Layer Routing with Irregular Structures;Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design;2022-10-30
3. Transitive Closure Graph-Based Warpage-Aware Floorplanning for Package Designs;Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design;2022-10-30
4. Y-architecture-based flip-chip routing with dynamic programming-based bend minimization;Proceedings of the 59th ACM/IEEE Design Automation Conference;2022-07-10