Reliability Studies of Novel Au-coated Ag (ACA) Bonding Wires-Reference-Cited by-同舟云学术

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Reliability Studies of Novel Au-coated Ag (ACA) Bonding Wires

Published:2023-10-25 Issue: Volume: Page:
ISSN:
Container-title:2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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Author:

Flauta Randolph E.¹,Garete April Joy¹,Sekaran Sreetharan²,Chen Haibin³

Affiliation:

1. Package R&D, Nexperia Hong Kong,Hong Kong

2. Central Process Engineering, Nexperia Malaysia,Seremban,Negeri Sembilan,Malaysia

3. Hong Kong University of Science and Technology (Guangzhou),Materials Characterization and Preparation Facility,Guangzhou,P.R. China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10348606/10348630/10348843.pdf?arnumber=10348843

Reference8 articles.

1. TIs journey to high-volume copper wire bonding production;Chaudry;Texas Instruments,2014

2. Challenges and developments of copper wire bonding technology

3. Reliability of Copper, Gold, Silver, and PCC Wirebonds Subjected to Harsh Environment

4. Development and qualification of copper wire bond process for automotive applications

5. Advancements in Silver Bonding Wire;Manoharan,2017

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