Comparison of Additive Manufacturing Methods for the Attachment of Bare Die to Printed Circuit Boards-Reference-Cited by-同舟云学术

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Comparison of Additive Manufacturing Methods for the Attachment of Bare Die to Printed Circuit Boards

Published:2022-07-10 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI)
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Author:

Areias Christopher¹,Lamport Emily¹,Piro Yuri¹,Cason Michael²,Armiento Craig¹,Akyurtlu Alkim¹

Affiliation:

1. Raytheon UMass Lowell Research Institute (RURI),University of Massachusetts Lowell

2. Raytheon Technologies, Missiles & Defense Lowell,MA,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9886005/9885799/09886376.pdf?arnumber=9886376

Reference7 articles.

1. Adaptive Patterning of Optical and Electrical Fan-Out for Photonic Chip Packaging

2. A Chip-First Microwave Package Using Multimaterial Aerosol Jet Printing

3. DC-to-Ka-band Broadband Chip-to-Chip Interconnect Using Aerosol Jet Printing

4. Fully Aerosol Jet Printed Interconnects and Fill Materials for Millimeter Wave Circuits

5. In Situ Nanocomposite Fabrication for RF Electronics Applications With Additive Manufacturing

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Additive Integration with Aerosol-Jet Printed SIWs;2023 53rd European Microwave Conference (EuMC);2023-09-19

2. A New Method for Improving Return Loss in Additively Integrated Bare Die Amplifiers;2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI);2023-07-23

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