A Monolithic Force Sensing Integrated Flexure Bonder Dedicated to Flip-Chip Active Soft-Landing Interconnection-Reference-Cited by-同舟云学术

A Monolithic Force Sensing Integrated Flexure Bonder Dedicated to Flip-Chip Active Soft-Landing Interconnection

Published:2021-02 Issue:1 Volume:26 Page:323-334
ISSN:1083-4435
Container-title:IEEE/ASME Transactions on Mechatronics
language:
Short-container-title:IEEE/ASME Trans. Mechatron.

Author:

Tang Hui¹^ORCID,He Sifeng¹^ORCID,Zhu Zhongyuan¹,Gao Jian¹^ORCID,Zhang Lanyu¹,Cui Chengqiang¹,Chen Xin¹

Affiliation:

1. State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment and the Guangdong Provincial Key Laboratory of Computer Integrated Manufacturing, Guangdong University of Technology, Guangzhou, China

Funder

National Natural Science Foundation of China

Science and Technology Planning Project of Guangdong Province

Foshan Key Technology

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Science Applications,Control and Systems Engineering

Link

http://xplorestaging.ieee.org/ielx7/3516/9355076/09177319.pdf?arnumber=9177319

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