Funder
National Natural Science Foundation of China
Zhejiang Provincial Natural Science Foundation of China
Scientific Research Fund of Sichuan Provincial of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics
Cited by
3 articles.
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1. Influence of Solder on De-Embedded Capacitance;2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC);2022-09-01
2. A Simple Solder-Free Fixture for Surface Mounted Device Measurement;2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT);2022-08-12
3. A Deembedding Method for the S-Parameter Extraction of Surface-Mounted Devices With Asymmetric Fixtures;IEEE Microwave and Wireless Components Letters;2021-02