Measurement and Analysis of Statistical IC Operation Errors in a Memory Module Due to System-Level ESD Noise-Reference-Cited by-同舟云学术

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Measurement and Analysis of Statistical IC Operation Errors in a Memory Module Due to System-Level ESD Noise

Published:2019-02 Issue:1 Volume:61 Page:29-39
ISSN:0018-9375
Container-title:IEEE Transactions on Electromagnetic Compatibility
language:
Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Park Myungjoon,Park Junsik^ORCID,Choi Joungcheul,Kim Jinwoo,Jeong Seonghoon,Seung Manho,Lee Seokkiu,Kim Jingook^ORCID

Funder

SK Hynix Inc.

National Research Foundation of Korea

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx7/15/8535058/08360768.pdf?arnumber=8360768

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Chip-Backside Vulnerability to Intentional Electromagnetic Interference in Integrated Circuits;IEEE Transactions on Electromagnetic Compatibility;2024

2. Study on ESD Protection Circuit by TCAD Simulation and TLP Experiment;Micromachines;2023-03-04

3. Accurate and Efficient Computation of System-Level ESD Noise Waveforms in ISO 10605 Standard Using Decomposition Method and Split-Domain Approach;IEEE Transactions on Electromagnetic Compatibility;2022-12

4. Detection Circuits for System-Level Signal and Power Noises Due to High-Power Electromagnetic Pulses;IEEE Transactions on Electromagnetic Compatibility;2022-08

5. A Proposed On-Die Oscilloscope for Monitoring of Power Noise Waveform Inside IC Due to Transient Stress Events;IEEE Transactions on Electromagnetic Compatibility;2022-04

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