Author:
Reuschel Torsten,Muller Sebastian,Schuster Christian
Funder
Deutsche Forschungsgemeinschaft
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics
Cited by
6 articles.
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1. Hybrid Fast Modeling of Via-Connected Traces in Multilayer Electronic Packages;2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa);2024-05-20
2. An Indefinite Impedance Matrix Technique for Efficient Analysis of Planar Circuits With Irregular Shapes;IEEE Journal on Multiscale and Multiphysics Computational Techniques;2024
3. Automated Generation and Correlation of Physics-Based Via Models with Full-Wave Simulation for an SI/PI Database;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15
4. Signal integrity analysis and Peripheral Component Interconnect Express backplane link compliance assessment;Engineering Reports;2021-10-29
5. Radiated EMC Kron's Model of 3-D Multilayer PCB Aggressed by Broadband Disturbance;IEEE Transactions on Electromagnetic Compatibility;2020-04