Author:
Feng Wei,Watanabe Naoya,Shimamoto Haruo,Aoyagi Masahiro,Kikuchi Katsuya
Cited by
3 articles.
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1. 38 GHz T/R Heterogeneous Integrated Module;2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP);2022-11-27
2. Thermal–Mechanical and Signal Reliability of a New Differentiated TSV;IEEE Transactions on Electron Devices;2022-10
3. Trench Isolation Technology for Cost-effective Wafer-level 3D Integration with One-step TSV;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06