Thermal–Mechanical and Signal Reliability of a New Differentiated TSV-Reference-Cited by-同舟云学术

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Thermal–Mechanical and Signal Reliability of a New Differentiated TSV

Published:2022-10 Issue:10 Volume:69 Page:5766-5772
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Liu Ziyu¹,Jiang Han²^ORCID,Zhu Zhiyuan²,Chen Lin¹^ORCID,Sun Qingqing¹^ORCID,Sun Yabin³^ORCID,Zhang David Wei¹

Affiliation:

1. State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, China

2. School of Electronic Information Engineering, Southwest University, Chongqing, China

3. Department of Electrical Engineering, East China Normal University, Shanghai, China

Funder

National Natural Science Foundation of China

Natural Science Foundation of Shanghai

Shanghai Science and Technology Innovation Action Plan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/16/9901396/09868336.pdf?arnumber=9868336

Reference23 articles.

1. Thermal–Mechanical Performance Analysis and Structure Optimization of the TSV in 3-D IC

2. Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array

3. Electrical model analysis & measurement of TSV to TSV coupling capacitance

4. Fast and Accurate Modelling of Large TSV Arrays in 3D-ICs Using a 3D Circuit Model Validated Against Full-Wave FEM Simulations and RF Measurements

5. TSV with Embedded Capacitor for ASIC-HBM Power and Signal Integrity Improvement

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature Cycling;Micromachines;2024-07-30

2. Effect of annealing residual stress on mobility of TSV vertical switch;IEICE Electronics Express;2024-05-25

3. 3d Package Thermal Analysis and Thermal Optimization;2024

4. 3d Package Thermal Analysis and Thermal Optimization;2024

5. Optimization of Wafer-level TTV Using RIE Applied for the Extreme Wafer Thinning;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

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