Thermal analysis of electromigration test structures-Reference-Cited by-同舟云学术

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Thermal analysis of electromigration test structures

Published:1987-03 Issue:3 Volume:34 Page:664-672
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Schafft H.A.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/16/31975/01486689.pdf?arnumber=1486689

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