Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Scaling analysis of multilevel interconnect temperatures for high-performance ICs;Im;IEEE Trans. Electron Devices,2005
2. Thermal analysis of electromigration test structures;Schafft;IEEE Trans. Electron Devices,1987
3. Self-consistent solutions for allowed interconnect current density—part I: implications for technology evolution;Hunter;IEEE Trans. Electron Devices,1997
4. Coupled analysis of electromigration reliability and performance in ULSI signal nets;Banerjee;ICCAD,2001
5. iTEM: a temperature-dependent electromigration reliability diagnosis tool;Teng;IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.,2002
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