Electrical characteristics and contact resistance of B+-and BF2+-implanted silicon diodes with furnace and rapid thermal annealing
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx5/16/31929/01484870.pdf?arnumber=1484870
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Tunnel oxide passivated contacts formed by ion implantation for applications in silicon solar cells;Journal of Applied Physics;2015-11-23
2. Rapid thermal annealing of graphene-metal contact;Applied Physics Letters;2012-12-10
3. The Annealing Time and Temperature Dependence of Electrical Dopant Activation in High‐Dose BF 2 Ion Implanted Silicon;Journal of The Electrochemical Society;1994-11-01
4. Device performance of shallow junction PMOSFETs fabricated using low-energy ion implantation of B and BF2 into crystalline and Ge preamorphised silicon;Electronics Letters;1989
5. Optimization of the germanium preamorphization conditions for shallow-junction formation;IEEE Transactions on Electron Devices;1988-05
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