A Tapped Stepped-Impedance Balun With Dual-Band Operations

Author:

Hualiang Zhang ,Yitian Peng ,Hao Xin

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Cited by 34 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Inherent Impedance Transformation and Isolation in Dual-Band Balun For RF Front End Applications;2024 Systems of Signals Generating and Processing in the Field of on Board Communications;2024-03-12

2. Analysis and Design of Concurrent Dual-band Distributed Baluns;2023 IEEE International Symposium on Circuits and Systems (ISCAS);2023-05-21

3. A Wideband Microstrip Line-Based Balun Structure for High Power Amplifier Applications;Modern Electronics Devices and Communication Systems;2023

4. Dual-band Microstrip Balun with Different Complex Load Impedances in Frequency Bands;Radioelectronics and Communications Systems;2023-01

5. A wideband, 25/40dBm high I/O power GaN HEMT ultra-low noise amplifier using even-odd mode techniques;Microelectronics Journal;2022-10

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