Author:
Abdennadher Salem,Tripician Kyle,Singaravelu Senthil
Cited by
5 articles.
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1. Metaconductor-Based High Signal Integrity Interconnects for 112 Gbps SerDes Interface with Channel Analysis;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. High Inheritability and Flexibility Smarttest8 Testmethod Library on Ultra-High-Speed Serdes Measurement;2022 China Semiconductor Technology International Conference (CSTIC);2022-06-20
3. A Protocol Layer Test Strategy of Interlaken Embedded in FPGA;2022 IEEE 10th Joint International Information Technology and Artificial Intelligence Conference (ITAIC);2022-06-17
4. SoIS- An Ultra Large Size Integrated Substrate Technology Platform for HPC Applications;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06
5. The missing pieces of open design enablement;Proceedings of the 39th International Conference on Computer-Aided Design;2020-11-02