Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders-Reference-Cited by-同舟云学术

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Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders

Published:2001 Issue: Volume: Page:
ISSN:
Container-title:Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)
language:
Short-container-title:

Author:

Schubert A.¹,Walter H.,Dudek R.,Michel B.,Lefranc G.,Otto J.,Mitic G.

Affiliation:

1. Fraunhofer-Inst. for Reliabilty & Microintegration, Berlin, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7325/19802/00916562.pdf?arnumber=916562

Cited by 50 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High Temperature Storage Simulation and Strain Analysis of Solder Ball in Fan-Out Wafer Level Package (FOWLP);2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Creep Viscoplastic Characterization of SAC Solders Exposed to Different Isothermal Aging;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24

3. A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics;Journal of Materials Science;2022-05

4. Effect of shear and tensile-dominant cyclic loading on failure in SnAgCu solder;Microelectronics Reliability;2021-05

5. Effect of Sb additions on the creep behaviour of low temperature lead-free Sn–8Zn–3Bi solder alloy;Soldering & Surface Mount Technology;2020-10-26

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