New dicing and thinning concept improves mechanical reliability of ultra thin silicon-Reference-Cited by-同舟云学术

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New dicing and thinning concept improves mechanical reliability of ultra thin silicon

Published:2001 Issue: Volume: Page:
ISSN:
Container-title:Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)
language:
Short-container-title:

Author:

Landesberger C.¹,Klink G.,Schwinn G.,Aschenbrenner R.

Affiliation:

1. Fraunhofer-Inst. for Reliability & Microintegration, Munich, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7325/19802/00916555.pdf?arnumber=916555

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